Capabilities · 02
Antenna & antenna-in-package co-design
The aperture, the package and the front-end optimised as one — because at mm-wave the interconnect is part of the antenna.
At millimetre-wave frequencies the transition between die and radiator dominates efficiency. We co-design the antenna, the antenna-in-package (AiP) and the front-end, so that impedance, loss and thermal budgets are addressed together from the start.
What this covers
- Antenna element and sub-array design for K/Ka/E/W bands.
- Antenna-in-package: die-to-radiator transitions, redistribution and feed networks.
- Joint electromagnetic / circuit optimisation of the front-end and aperture.
- Thermal and mechanical co-planning for dense active apertures.
Tools
Full-wave electromagnetic solvers (e.g. HFSS / CST class) coupled with circuit and system-level simulation, closing the loop between the IC and the radiating structure.